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The Source/Drain Engineering of Nanoscale Germanium-based MOS Devices

SPRINGER
06 / 2016
9783662496817
Inglés
Springer Theses
Ingles
Nanociencias

Sinopsis

This book mainly focuses on reducing the high parasitic resistance in the source/drain of germanium nMOSFET. With nbsp;adopting of the Implantation After Germanide (IAG) technique, P and Sb co-implantation technique and Multiple Implantation and Multiple Annealing (MIMA) technique, the electron Schottky barrier height of NiGe/Ge contact is modulated to 0.1eV, the thermal stability of NiGe is improved to 600? and the contact resistivity of metal/n-Ge contact is drastically reduced to 3.8×10?7??cm2, respectively. Besides, a reduced nbsp;source/drain parasitic resistance is demonstrated in the nbsp;fabricated Ge nMOSFET. Readers will find useful information about the source/drain engineering technique for high-performance CMOS devices at future technology node.

PVP
51,99€